1. |
2019/04/17 |
Integration of GaN-SiC and GaN-diamond by surface activated bonding methods(International Conference on Electronics Packaging (ICEP 2019))
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2. |
2019/04/17 |
Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature(International Conference on Electronics Packaging (ICEP 2019))
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3. |
2019/05/21 |
Low temperature all-Cu bonding via Cu-nanoparticle paste sintering in Pt-catalyzed formic acid vapor(2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D))
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4. |
2019/05/21 |
GaN-SiC and GaN-diamond integration via room temperature bonding(2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D))
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5. |
2019/05/21 |
SiC-SiC temporary bonding compatible with rapid thermal annealing at 1000oC(2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D))
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6. |
2019/05/21 |
Room temperature SiC wafer bonding using SAB methods(2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D))
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7. |
2019/05/21 |
The integration of Ga2O3 on SiC at room temperature by surface activated bonding method(2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D))
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8. |
2019/05/21 |
Microsystem Integration and Packaging – A Chronicle of the Surface Activated Bonding and its Future Outlook(2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D))
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9. |
2019/05/28 |
Temporary SiC-SiC wafer bonding compatible with high temperature annealing(The 2019 IEEE 69th Electronic Components and Technology Conference (ECTC-2019))
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10. |
2019/05/21 |
Low temperature copper-copper bonding in ambient air using hydrogen radical pretreatment(2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D))
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11. |
2019/05/21 |
Room Temperature Bonding of Quartz Glass using Aluminum Oxide Intermediate Layer(2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D))
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12. |
2018/07/29 |
Room-temperature wafer bonding using smooth Au thin films for integrated plasmonic devices(IEEE 2018 International Conference on Optical MEMS and Nanophotonics (OMN 2018))
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13. |
2018/11/19 |
Surface analysis of argon and oxygen plasma-treated gold for room temperature wafer scale gold-gold bonding(2018 IEEE CPMT Symposium Japan (ICSJ))
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14. |
2019/04/17 |
Wafer scale Au-Au surface activated bonding using atmospheric-pressure plasma(2019 International Conference on Electronics Packaging (ICEP))
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15. |
2019/05/21 |
Room-temperature pressureless wafer sealing using ultrathin Au films activated by Ar plasma(2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D))
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16. |
2019/05/21 |
Room Temperature Wafer Bonding with Titanium Thin Films Based on Formation of Ti/Si Amorphous Layers(2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D))
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17. |
2019/07/07 |
Room temperature direct bonding of GaN to Diamond using the surface activated bonding (SAB) method(8th Applied Optics and Photonics China, 2019 (AOPC 2019))
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18. |
2019/07/07 |
Permanent and Temporary SiC-SiC Wafer Bonding Using the Surface Activated Bonding (SAB) Method(The Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM-2019))
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19. |
2019/09/04 |
表面活性化手法による SiC,GaN の常温接合の新展開(日本セラミックス協会 セラミックコーティング研究会)
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20. |
2019/09/16 |
Room Temperature Bonding of GaN to Si and Diamond by means of the Surface Activated Bonding (SAB) Method(The European Materials Research Society (E-MRS) 2019 Fall Meeting)
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21. |
2019/10/08 |
Innovative bonding technology for 3D integration(IEEE International 3D Systems Integration Conference 2019 (3DIC2019))
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22. |
2019/10/24 |
Surface Activated Bonding for GaN-SiC and GaN-diamond(IMPACT-IAAC 2019)
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23. |
2019/10/25 |
A Chronicle of the Surface Activated Bonding and its Future Outlook(2019 Symposium of Micro- and Nano-Metallization Process Technology Alliance)
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24. |
2019/11/08 |
表面活性化による異種材料の常温接合(日本電子材料技術協会 第 56 回秋期講演大会)
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25. |
2019/11/28 |
3D and Heterogeneous Integration using the Surface Activated Bonding (SAB) Method(The 11th International Electronics Cooling Technology Workshop (CTW2019))
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26. |
2019/12/03 |
Surface activate bonding (SAB) for GaN-diamond integration with high thermal boundary conductance(WaferBond'19 - Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration)
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27. |
2020/04/22 |
Room temperature bonding for microsystem integration(MEMS Engineer Forum (MEF) 2020)
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28. |
2020/03/12 |
常温接合と界面制御 Interface Science and Engineering for Room Temperature Bonding(2020年第67回応用物理学会春季学術講演会)
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29. |
2019/12/07 |
First Demonstration of Waferscale Heterogeneous Integration of Ga2O3 MOSFETs on SiC and Si Substrates by Ion-Cutting Process(2019 IEEE International Electron Devices Meeting (IEDM))
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30. |
2019/07/28 |
Room-temperature bonding of organic films using ultrathin Au intermediate layers for organic integrated optical devices(2019 International Conference on Optical MEMS and Nanophotonics (OMN))
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31. |
2019/11/27 |
異種基板の張り合わせと界面熱抵抗(Microwave Workshops & Exhibition (MWE 2019))
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32. |
2019/11/10 |
Surface activated bonding between GaN and SiC with an ultralow TBR(The 9th Asia-Pacific Workshop on Widegap Semiconductors (APWS 2019))
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5件表示
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全件表示(32件)
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